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家へ > 製品 > 半自動BGA再加工ステーション > High Precision BGA Rework Station ZM-R6200 LED Module Repair Machine with Laser Position HDD Camera

High Precision BGA Rework Station ZM-R6200 LED Module Repair Machine with Laser Position HDD Camera

製品詳細

起源の場所: 中国

ブランド名: WISDOMSHOW

証明: CE, ISO, FDA

モデル番号: WDS620

ドキュメント: 製品説明書 PDF

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最小注文数量: 1

お問い合わせ
ハイライト:
最大マウティング負荷:
150g
タイプ:
半自動
取り付け精度:
±0.01mm
重さ:
12kg
機械の重量:
60kg
チップサイズ:
ミニ 1*1mm
チップサイズを適用する:
0.8*0.8~120*120mm
最大マウティング負荷:
150g
適当なPCBの厚さ:
0.5~5mm
電源:
5300W
BGAチップサイズ:
最大120*120mm 最低0.8*0.8mm
応用:
BGA (ボール グリッド アレイ) リワーク
プリント基板サイズ:
最大470×380mm
コアコンポーネント:
PLC
電圧:
220V
最大マウティング負荷:
150g
タイプ:
半自動
取り付け精度:
±0.01mm
重さ:
12kg
機械の重量:
60kg
チップサイズ:
ミニ 1*1mm
チップサイズを適用する:
0.8*0.8~120*120mm
最大マウティング負荷:
150g
適当なPCBの厚さ:
0.5~5mm
電源:
5300W
BGAチップサイズ:
最大120*120mm 最低0.8*0.8mm
応用:
BGA (ボール グリッド アレイ) リワーク
プリント基板サイズ:
最大470×380mm
コアコンポーネント:
PLC
電圧:
220V
High Precision BGA Rework Station ZM-R6200 LED Module Repair Machine with Laser Position HDD Camera
Hot Air Infrared Combo BGA Rework Station WDS620
High Precision BGA Reballing Machine - WDS 620 BGA Reballing Machine, AC 220V BGA Soldering Machine
Technical Specifications
Power Supply AC 220V±10% 50/60Hz
Total Power 5200W
Upper Heater Power Max 1200W
Lower Heater Power Max 1200W
IR Heater Power Max 2700W
Detailed Parameter Specification
Power Supply AC 110V/220V±10% 50/60Hz
Total Power Max 5300W
Heater Power Distribution Upper zone: 1200W, Second zone: 1200W, IR zone: 2700W
Electrical Components Driving motor + PLC smart temperature controller + color touch screen
Temperature Control High precision K-sensor (Closed Loop), independent temperature controller, precision ±1℃
Positioning System V-shape slot, adjustable PCB support jigs, laser light for fast centering and positioning
PCB Size Range Max 500*380mm, Min 10*10mm
Applicable Chip Sizes Max 80*80mm, Min 1*1mm
Overall Dimensions 650*630*850mm (L*W*H)
Temperature Interface 1 unit
Machine Weight 60KG
Color White & Blue
Advanced Operating Modes
The WDS-620 features 5 operational modes: Remove, Mount, Weld, Manual, and Semi-auto. Operators can freely switch between automatic, semi-automatic, and manual operation modes.
Independent 3-Zone Temperature Control System
  • Upper and lower hot air heating simultaneously targets components and PCB
  • Bottom IR heating with temperature precision control within ±1℃
  • 8-segment independent temperature control system
  • Hot air district heating for BGA and PCB simultaneously
  • Large area IR heater preheating prevents PCB deformation during rework
  • Upper and lower temperature zones can operate independently or combined
  • High precision K-type thermocouple closed-loop control with PID parameter self-setting
  • 4 temperature curves display with instant analysis function
  • Multiple user data profiles can be saved
  • External measurement interface for precise temperature testing
Precision Optical Alignment System
High-definition adjustable CCD color optical alignment system with beam split, amplification, reduction, and auto-focus capabilities. Features automatic color aberration resolution, brightness adjustment, and adjustable image contrast. Equipped with 15" high-definition LCD monitor.
Multi-Functional Operation System
  • High-definition touch human-machine interface
  • Upper heating head and mounting head designed as 2-in-1 unit
  • Multiple titanium alloy BGA nozzles with 360-degree rotation
  • X, Y, and R angle micrometer fine-tuning with ±0.01mm precision
Safety Protection Features
  • Automatic alarm function after BGA welding completion
  • Automatic circuit power-off during temperature abuse conditions
  • Dual over-temperature protection system
  • Temperature parameter password protection to prevent unauthorized modifications